RF Package Design Engineer (m/f)

Harvey Nash GmbH supports many of Germanys leading organisations to source, recruit and manage the highly skilled IT and engineering talent they need to succeed in an increasingly technology-driven world.

We offer some of the most interesting and challenging roles where you get to work with the latest IT Technologies with some of the biggest clients in Germany.

For our client, a global R&D Chip Provider we are looking for a RF Package Design Engineer (RF) (m/f) for the location Munich.

Project Start: ASAP

Project duration: 12 Months

Location: Munich

Languages: English

Main Tasks:

- Developing optimized layout design for RF ICs using todays most advanced packaging technologies
- Maintaining design connectivity, chip floorplan and pinout as well as ball map updates
- Developing test vehicle designs to further optimize packaging technologies and methods
- Aligning PCB and Chip Floorplan requirements

Skills:

- Basic understanding of RF circuits and analogue circuits in general
- Cadence SIP expertise (System-in-Package) or Mentor Expedition experience is a must have
- Knowledge of thermal / mechanical / electrical design constraints
- Understanding of Signal- and Power integrity requirements
- Understanding the needs of Board and Chip Layout Requirements and how to co-design in a complex and multi-constraint design environment
- Excellent know-how of modern Packaging EDA Software
- Knowledge of Cadence Virtuoso Layout Editor would be nice to have but not required.
- Good knowledge of UNIX, Scripting Languages (Tcl, Shell, Perl,), Data Management

Languages:

Written and spoken English know-how is demanded, all documentation will be in English

If you are interested in this vacancy (334500), we would be pleased to receive your updated CV, availability and your salary expectations

Please feel free to contact me if you have any questions.