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Simulation Engineering Signal Integrity

Eingestellt von FERCHAU GmbH aus Gummersbach

Gesuchte Skills: Engineering, Design, Automotive, Spice

Projektbeschreibung

* Appropriate selection and definition of High-Speed design constraints (topology, termination, crosstalk avoidance) for various interfaces.
* Definition of multilayer PCB-Stackups considering impedances and materials.
* Signal integrity simulation and analysis of various parallel and serial interfaces (DDR2/3, LPDDR4, USB2/3), single ended and differential signals.
* Timing analysis of critical interfaces and validation of their design margins.
* Verification of simulation models; IBIS, Spice, Touchstone.
* Implementation of High-Speed PCB-Layout constraints into constraints database.
* Schematic reviews, PCB layout reviews and PCB layout support.
* Correlation of simulation and measurement.
* Compliance measurements.
* Creation of detailed reports and presentations

VORAUSSETZUNGEN:

* Degree in communications engineering, electrical engineering or comparable.
* Several years of experience in the automotive industry.
* Experienced with 2D and 3D EM simulation tools like Hyper Lynx, CST Studio
* Experienced with Signal Integrity and Timing Analysis with very good analysis skills.
* Proficient in High-Speed measurements.
* Good knowledge in EMC.
* Good knowledge in PCB technologies.
* Good command of German and English.
* Familiar with MS-Office tools.
* Self-dependent and highly problem-solving oriented way of working.
* Strong team player with good communications skills.

Projektdetails

  • Einsatzort:

    Karlsruhe (Baden), Deutschland

  • Projektbeginn:

    asap

  • Projektdauer:

    40 Woche(n)

  • Vertragsart:

    Contract

  • Berufserfahrung:

    Keine Angabe

Geforderte Qualifikationen

FERCHAU GmbH

  • Straße:

    Steinmüllerallee 2

  • Ort:

    51643 Gummersbach, Deutschland