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Simulation Engineering Signal Integrity
Eingestellt von FERCHAU GmbH aus Gummersbach
Gesuchte Skills: Engineering, Design, Automotive, Spice
Projektbeschreibung
* Definition of multilayer PCB-Stackups considering impedances and materials.
* Signal integrity simulation and analysis of various parallel and serial interfaces (DDR2/3, LPDDR4, USB2/3), single ended and differential signals.
* Timing analysis of critical interfaces and validation of their design margins.
* Verification of simulation models; IBIS, Spice, Touchstone.
* Implementation of High-Speed PCB-Layout constraints into constraints database.
* Schematic reviews, PCB layout reviews and PCB layout support.
* Correlation of simulation and measurement.
* Compliance measurements.
* Creation of detailed reports and presentations
VORAUSSETZUNGEN:
* Degree in communications engineering, electrical engineering or comparable.
* Several years of experience in the automotive industry.
* Experienced with 2D and 3D EM simulation tools like Hyper Lynx, CST Studio
* Experienced with Signal Integrity and Timing Analysis with very good analysis skills.
* Proficient in High-Speed measurements.
* Good knowledge in EMC.
* Good knowledge in PCB technologies.
* Good command of German and English.
* Familiar with MS-Office tools.
* Self-dependent and highly problem-solving oriented way of working.
* Strong team player with good communications skills.
Projektdetails
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Einsatzort:
Karlsruhe (Baden), Deutschland
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Projektbeginn:
asap
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Projektdauer:
40 Woche(n)
- Vertragsart:
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Berufserfahrung:
Keine Angabe
Geforderte Qualifikationen
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Kategorie:
Medien/Design, Ingenieurwesen/Technik