Vakante Jobangebote finden Sie unter Projekte.
RF Package Design Engineer (m/f)
Eingestellt von Hays aus Mannheim, Universitätsstadt
Gesuchte Skills: Design, Engineer
Projektbeschreibung
355007/3
IHRE AUFGABEN:
-Developing optimised layout design for RF ICs using today's most advanced packaging technologies
-Maintaining design connectivity, chip floor plan and pinout as well as ball map updates
-Developing test vehicle designs to further optimise packaging technologies and methods
-Aligning PCB and chip floor plan requirements
IHRE QUALIFIKATIONEN:
-Basic understanding of RF circuits and analogue circuits in general
-Knowledge of thermal/mechanical/electrical design constraints
-Understanding of signal and power integrity requirements
-Understanding the needs of board and chip layout requirements and how to co-design in a complex and multi-constraint design environment
-Excellent know-how of modern Packaging EDA software
-Knowledge of Cadence Virtuoso Layout Editor
-Good knowledge of UNIX, scripting languages (Tcl, Shell, Perl etc.) and data management
-Fluency in English, German language skills are beneficial
WEITERE QUALIFIKATIONEN:
Hardware developer
Projektdetails
-
Einsatzort:
München, Deutschland
-
Projektbeginn:
asap
-
Projektdauer:
6 MM
- Vertragsart:
-
Berufserfahrung:
Keine Angabe
Geforderte Qualifikationen
-
Kategorie:
Medien/Design, Ingenieurwesen/Technik
Hays
-
Straße:
Willy-Brandt-Platz 1-3
-
Ort:
68161 Mannheim, Universitätsstadt, Deutschland