RF Package and Assembly Engineer

Our leading international Semiconductor partner is looking for Senior Package and Assembly Engineer RF Engineer. The Package Development Engineer will be at the leading edge of initiating and implementing breakthrough developments in advanced semiconductor device packages.

Project description:
Support our RF Engineers with all relevant package and assembly aspects to enable optimal product development
Development and production release of new RF Power packages, covering both technical as well as Project Management aspect.
Establish, implement and release new assembly processes in close cooperation with our Far-east manufacturing sites.
Own and maintain assembly design rules for our High Performance RF packaging portfolio (both plastic and ceramics)
Generate and validate new assembly design rules for new or changed package platforms, including:
generation of test vehicle concepts to be used for this validation
Equipment MSA, tolerance analysis and DOE planning and execution
documentation
Participate in Industrial & Quality improvement teams.

Responsibilities:
The Package Development Engineer will be at the leading edge of initiating and implementing breakthrough developments in advanced semiconductor device packages. You will work in a multi-disciplinary and multi cultural environment, working in project teams to create highly advanced and cost-effective device package solutions that meet the ever-increasing performance, reliability and cost requirements.

The Package Development Engineer has a broad range of skills in the following areas:
- Package Innovation
- Quality and reliability
- Volume Manufacturing
- Building and maintaining contacts with key suppliers