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Microelectronical Devices Package and Assembly Engineer
Eingestellt von Tangent International
Gesuchte Skills: Engineer, Cad, Design
Projektbeschreibung
Tangent International are seeking an experienced Microelectronics Package and Assembly Engineer to work on a 6 month project in The Netherlands
Strong experience in packaging and assembly of Microelectronical devices is essential for this role as is experience in using CAD Design Tools
If you have the above experience and you are interested in this exciting opportunity please submit a copy of your current cv to me urgently!
Projektdetails
- Einsatzort:
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Projektbeginn:
asap
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Projektdauer:
6 months
- Vertragsart:
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Berufserfahrung:
Keine Angabe
Geforderte Qualifikationen
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Kategorie:
Medien/Design, Ingenieurwesen/Technik