Expert Package Technology Innovation (m/f)

Our client is an international operating company in the semiconductor area. For its location in Munich it is looking for several Experts in Package Technology Innovation.

Unlimited permanent position direct with our customer

Your Responsibilities

You will be responsible for package development and innovation activities for cellular applicatons, including packages for several applications like Modems, Transceivers etc. and combinations
You will extend existing packaging platforms like FlipChip (FC), Embedded Wafer Level Ball Grid Array (eWLB) or Chip Scale Package/Wafer Level Chip Scale Package (WLCSP) package Technologies to future challenges and cost reduction of packaging
You will be responsible for invention disclosures and patent applications
You will establish a packaging roadmap, starting today and covering the next five years
You will work closely with manufacturing Partners (3rd party companies etc.), external IP providers, tool vendors, component suppliers as well as with tue internal manufacturing and packaging development organization

Your Qualifications

Degree in electrical engineering
Minimum 5 years of professional experience in semiconductor package design and / or electrical simulation
Experience with Cadence SIP design tool, Mentor or similar
Good understanding of high speed signal interface design requirements
Profound knowledge of package design rules /limitations and their influence on cost and manufacturability for Flip Chip laminate and wafer level type of packages
Experienced in modeling, parasitic extraction, signal and power integrity simulation with standard tools, i.e. SPICE circuit solvers, 2.5 and 3D EM simulation as well as broadband macromodelling
Strong communication skills
Interested to work in a global environment and multicultural team
Fluent English language skills

We are offering a position with a pleasant & international working atmosphere with exceptionally high customer satisfaction. The company hires talented people and want to enable them to reach their full potential.

Please send your application via mail to [email protected]