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Expert Package Design and Simulation (m/f)

Eingestellt von Harveynash

Gesuchte Skills: Design, Engineering, Spice

Projektbeschreibung

Our client is an international operating company in the semiconductor area. For its location in Munich it is looking for several Experts in Package Design and Simulation (m/f)

Unlimited permanent position direct with our customer

Your Responsibilities

You will be responsible for the package Design and layout of baseband processors, Transceivers, Power Management Integrated Circuits PMICs) and System on Chips covering communicaton-application- and Graphik Prozessor functionality
You will conduct routing and feasibility studies during the product concept phase
You will be part of the co-design process team for the product development
You will have an impact on the chip flor plan and chip pad arrangement as well as on the corresponding ball assignment and arrangement on the printed circuit board (PCB), to find the optimum package design
You will verify the necessary signal and power integrity of critical high speed interfaces within the system, including the chip, the package, PCB and final load like corresponding memory devices by electrical modelling/simulation
You will be responsible for the alignment with manufacturing partners and the internal manufacturing organization for the design freeze, as well as with external IP providers, tool vendors and components suppliers to get adequate models for simulation

Your Qualifications

Degree in electrical engineering
Minimum 5 years of professional experience in semiconductor package design and / or electrical simulation
Experience with Cadence SIP design tool, Mentor or similar
Good understanding of high speed signal interface design requirements
Profound knowledge of package design rules /limitations and their influence on cost and manufacturability for Flip Chip laminate and wafer level type of packages
Experienced in modeling, parasitic extraction, signal and power integrity simulation with standard tools, i.e. SPICE circuit solvers, 2.5 and 3D EM simulation as well as broadband macromodelling
Strong communication skills
Interested to work in a global environment and multicultural team
Fluent English language skills

We are offering a position with a pleasant working & international atmosphere with exceptionally high customer satisfaction. The company hires talented people and want to enable them to reach their full potential.

Please send your application via mail to [email protected]

Projektdetails

  • Einsatzort:

    München, Deutschland

  • Projektbeginn:

    asap

  • Projektdauer:

    Keine Angabe

  • Vertragsart:

    Permanent

  • Berufserfahrung:

    Keine Angabe

Geforderte Qualifikationen

Harveynash