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Design Flow Engineer for Chip/Package/PCB Simulation (m/f)
Eingestellt von Hays aus Mannheim, Universitätsstadt
Gesuchte Skills: Design, Engineer
Projektbeschreibung
295026/6
IHRE AUFGABEN:
-Improve design methodology for electrical and thermal chip/package/PCB co-simulation
-Responsibility for requirement collection, analysis, methodology definition, implementation, roll-out, training and support – based on input from internal chip, package and PCB designers
-Evaluate EDA tools and their features
-Coordinate feature/software development activities at EDA vendors or outsource partners
IHRE QUALIFIKATIONEN:
-Experience in package or PCB design (EM-field simulation, RF design) is of advantage
-Knowledge of Linux and programming (e.g. Java, Perl, Tcl, C++)
-Experience in electrical FEM simulation on chip/package/PCB level with Ansys FEM tools (HFSS, Q3D, SiWave)
-Experience in thermal simulation is of advantage (Ansys Icepak, Workbench etc.)
WEITERE QUALIFIKATIONEN:
Hardware developer
Projektdetails
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Einsatzort:
Carinthia, Österreich
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Projektbeginn:
asap
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Projektdauer:
6 MM++
- Vertragsart:
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Berufserfahrung:
Keine Angabe
Geforderte Qualifikationen
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Kategorie:
Medien/Design, Ingenieurwesen/Technik